Main Function Introduction
1. Automatically cut and lay up EVA onto glass according to the required dimensions.
2. Suitable for cutting encapsulation materials such as module-grade EVA/POE, with a processing thickness range of 0.2mm to 0.8mm.
3. EVA cutting accuracy is within ±2mm, and the diagonal error is ≤ ±2mm.
4. Ensures smooth layup of EVA on glass without defects such as folding or wrinkling.
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